JPH02114966U - - Google Patents
Info
- Publication number
- JPH02114966U JPH02114966U JP2433189U JP2433189U JPH02114966U JP H02114966 U JPH02114966 U JP H02114966U JP 2433189 U JP2433189 U JP 2433189U JP 2433189 U JP2433189 U JP 2433189U JP H02114966 U JPH02114966 U JP H02114966U
- Authority
- JP
- Japan
- Prior art keywords
- tester
- drill
- jig
- insulated
- modifying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 description 2
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2433189U JPH02114966U (en]) | 1989-03-02 | 1989-03-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2433189U JPH02114966U (en]) | 1989-03-02 | 1989-03-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02114966U true JPH02114966U (en]) | 1990-09-14 |
Family
ID=31244086
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2433189U Pending JPH02114966U (en]) | 1989-03-02 | 1989-03-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02114966U (en]) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04250695A (ja) * | 1991-01-28 | 1992-09-07 | Matsushita Electric Works Ltd | 多層回路板のバイアホール加工方法 |
JP2014187153A (ja) * | 2013-03-22 | 2014-10-02 | Via Mechanics Ltd | 多層プリント配線板のバックドリル加工方法、そのためのドリル及び基板穴明け装置 |
-
1989
- 1989-03-02 JP JP2433189U patent/JPH02114966U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04250695A (ja) * | 1991-01-28 | 1992-09-07 | Matsushita Electric Works Ltd | 多層回路板のバイアホール加工方法 |
JP2014187153A (ja) * | 2013-03-22 | 2014-10-02 | Via Mechanics Ltd | 多層プリント配線板のバックドリル加工方法、そのためのドリル及び基板穴明け装置 |